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1 Materials Behavior1

Introduction1

Process Innovation as Driver of Technological Growth2

Single-Crystal Turbine Blades2

Copper Interconnects for Microelectronic Packages2

Tungsten Filament for Light Bulbs3

Tailor-Welded Blanks3

Atomic Bonding in Materials4

Crystal Structure6

Defects in Crystalline Solids10

Annealing14

Diffusion in Crystalline Solids17

Mechanical Behavior21

Strengthening of Metals26

Fracture Mechanics27

Fatigue31

Creep34

Deformation Processing35

Heat Treatment35

Precipitation Hardening44

Thermal Properties45

Electrical Properties48

Dielectric and Magnetic Properties50

Optical Properties52

2 Casting and Solidification57

Casting Techniques57

Expendable-Mold Casting58

Green Sand Casting58

Thermal Considerations65

Dry Sand and Skin-Dried Molds69

Sodium Silicate-CO2 Process69

Vacuum Molding70

Shell-Molding71

Investment Casting72

Lost-Foam Casting74

Other Expendable Mold Processes75

Multiple-Use Mold Casting75

Permanent Mold Casting75

Die Casting and Semisolid Casting77

Squeeze Casting83

Centrifugal Casting86

Continuous Casting86

Single-Crystal Casting and Directionally Solidified Structure86

Fluidity95

Melt Treatments98

Metallic Foams and Gasars100

Melting Furnaces102

Mold-Filling Time102

Gate and Runner Area Calculation105

Temperature Drop in Metal Flow106

Riser Design111

Naval Research Lab Method113

Riser Size Estimation Using Chvorinov’s Rule116

Solidification Rate119

Sand Mold119

Die Casting122

Stages of Solidication—Nucleation and Growth125

Nucleation125

Homogeneous Nucleation126

Heterogeneous Nucleation130

Nucleation and Grain Refinement133

Growth During Solidification134

Atomic Structure at the Solidification Interface134

Growth in Pure Metals137

Growth of Single-Phase Alloys139

Constitutional Supercooling and Interface Instability142

Eutectic Solidification146

Solidification of Industrial Castings：149

Grain Structure149

Segregation151

Constrained Solidification in Small Regions153

Rapid Solidification and Metallic Glass157

Weld Solidification158

Solidification Under Reduced Gravity160

Interactions of Solidification Front with Insoluble Particles162

3 Powder Metallurgy and Ceramic Forming167

Crystalline Ceramics and Glasses167

Powder Metallurgy172

Powder Production172

Solidification of Atomized Droplets174

Other Methods of Powder Manufacture176

Particle Size and Shape177

Powder Mixing179

Powder Compaction180

Dynamics of Powder Densification181

Isostatic Compaction and Hot Isostatic Compaction（HIP）185

Analysis of Pressure Distribution in Uniaxial Compaction185

Pressure Distribution in an Annular Cylinder187

Powder Injection-Molding（PIM）188

Rheological Considerations in Powder Injection-Molding191

Settling and Segregation in Powder Injection-Molding Slurries195

Sintering197

Mechanism of Sintering198

Other Considerations in Sintering203

Homogenization203

Coarsening205

Ceramic Forming207

Slip-Casting207

Tape-Casting213

Ceramic Extrusion215

Electrolytic and Electrophoretic Deposition216

Glass Forming220

Pore Characterization224

Properties of Ceramics227

Mechanical Properties227

Thermal Properties232

Electrical and Electronic Properties235

Oxidation and Corrosion Resistance237

Bioceramics and Porous Ceramic Foams240

Joining of Ceramics241

4 Surface，Subsurface，and Interface Phenomena247

Surface Forces248

Electrostatic Forces248

Van der Waals Forces250

Contact Angle，Surface Tension，and Young’s Equation251

Grain Boundaries in Polycrystals254

Three-Phase Equilibrium255

Microscopic Angles and Precursor Film257

Roughness and Chemical Inhomogeneity257

Dynamic Contact Angles260

Immersion of Solids in Liquids264

Gas-Solid Attachment and Gas Stabilization268

Agglomeration268

Capillary Flow273

Capillary Pressure273

Capillary Rise275

Wettability and Capillary Rise at High Temperatures280

Effect of Oxide on Liquid280

Alloying and Surface Coatings282

Reactive Infiltration283

Reactive Penetration285

Capillary Flow with Unsteady Contact Angle and Pore Size286

Joining289

Adhesion296

Capillarity in Miscellaneous Other Processes298

Wear，Friction，and Lubrication301

Corrosion307

5 Coatings and Surface Engineering313

Design and Development of Coatings313

Surface Pretreatments314

Coating Techniques316

Vapor-Phase Deposition316

Nucleation and Growth in Vapor Condensation320

Ion-Nitriding324

Thermal Spray-Coating325

Physical Considerations in Thermal Spraying326

Structure，Properties，and Applications of Thermal Spray Coatings332

Electroplating338

Physical Considerations338

Plating Practice339

Electroless Plating343

Anodizing345

Coatings on Powders and Fibers348

Organic Coatings—Paints and Powders348

Powder Coatings351

Electrostatic Powder Spray351

Electrocoating352

Conversion Coatings353

Vitreous Ceramic Coatings353

Surface Hardening355

Selective Hardening355

Diffusion Hardening357

Laser Surface-Engineering361

Laser-Materials Interaction361

Types of Lasers362

Lasers as Surface-Engineering Tools363

Characteristics of Laser Surface Engineering364

Laser Surface Heating368

Laser Surface Melting372

Solidification Structure374

Laser Surface Alloying377

Laser-Induced Ceramic Coating381

Laser-Cladding382

Laser-Induced Combustion Synthesis387

Laser Surface-Vaporization387

Laser Surface-Texturing388

Laser Surface Cleaning390

Laser Surface-Marking391

Laser Surface-Shocking391

Miscellaneous Laser Processes391

Residual Stress State of Laser-Treated Surface392

Promise of Lasers in Surface-Engineering394

6 Composite Materials397

Definition and Classification397

Fibers398

Glass399

Boron399

Carbon Fiber400

Organic Fibers402

Metallic Fibers402

Ceramic Fibers403

Interface406

Fiber Strengthening409

Polymer-Matrix Composites410

Matrix410

Properties of Polymeric Matrices414

Polymer Composites414

Ceramic-Matrix Composites418

Carbon-Carbon Composites423

Chemical Vapor Infiltration425

Metal-Matrix Composites429

Heat-Resistant Composites429

Dispersion-Strengthened Composites429

In Situ Composites433

Particulate and Fiber-Reinforced High-Temperature Alloys436

Fabrication of Metal-Matrix Composites439

Solid-State Fabrication440

Liquid-State Fabrication445

Infiltration445

Reactive Infiltration448

Stirring Techniques453

Low-Cost Composites by Casting455

Other Liquid-Phase Techniques457

Wettability and Bonding458

Ni-Base Composites458

Properties460

Interface Strength460

Fiber Strength467

Stiffness，Strength，and Ductility469

Fatigue and Fracture Toughness475

Other Properties476

Creep476

Vibration Damping477

Wear and Friction477

Thermal Properties480

Thermal Fatigue482

Oxidation Resistance483

7 Semiconductor Manufacturing485

Introduction485

Integrated Circuit Applications and Market485

Feature Size and Wafer Size486

Technology Trends489

Fundamentals of Semiconductors489

Crystal Structure of Silicon489

Energy Band Theory493

The Fermi Level495

Intrinsic Semiconductor495

Extrinsic Semiconductor497

Dopant Concentration and Conductivity498

Diodes498

Bipolar Junction Transistors（BJT）500

Metal Oxide Field Effect Transistors（MOSFET）503

Crystal Growth and Wafer Preparation504

Czokhralski Method505

Floating-Zone Method506

Defects507

Wafer Preparation510

Initial Steps510

Wafer Slicing510

Postslicing Polishing and Cleaning511

Oxidation512

Properties of Silicon Dioxide512

Oxidation Techniques512

Oxidation Furnaces and Factors Affecting Oxide Growth514

Characterization of Oxide Films515

Simulation517

Diffusion517

Fick’s Diffusion Equations518

Constant Source Diffusion519

Limited Source Diffusion519

Diffusion Coefficient520

Concentration-Dependent Diffusion520

Lateral Diffusion521

Junction Depth521

Sheet Resistance521

Simulation522

Ion Implantation522

Ion Implanter522

Channeling523

Implantation Damage524

Annealing524

Rapid Thermal Annealing524

Photolithography524

Introduction524

Optical Lithography526

The Clean Room526

The Pattern Transfer Process527

Exposure Systems530

Masks and Resists532

Thin Film Deposition532

Vacuum Deposition Techniques532

Physical Vapor Deposition532

Evaporation533

Sputtering534

Reactive Sputtering535

Radio Frequency（RF）Sputtering535

Magnetron Sputtering535

Collimated Sputtering535

Ionized Magnetron Sputtering536

Chemical Vapor Deposition536

Epitaxy537

Molecular Beam Epitaxy537

Nonvacuum Deposition Techniques537

Chemical Bath Deposition537

Spin-On Deposition538

Etching538

Introduction538

Etching Types538

Wet Etching538

Dry Etching539

Ion Beam Milling539

Plasma Etching540

Reactive Ion Etching540

Metallization540

Ohmic Contacts540

Metals and Alloys541

Junction Spiking541

Electromigration542

Copper Metallization542

Damascene Technology543

Chemical Mechanical Polishing（CMP）544

Silicide544

Packaging546

Traditional Packaging546

Advanced Packaging547

Yield and Reliability548

Yield548

Processing Effects548

Circuit Sensitivities548

Point Defects549

Reliability549

8 Nanomaterials and Nanomanufacturing551

Introduction551

Nanotubes，Nanoparticles，and Nanowires552

Methods Using Solid Precursors554

Inert Gas Condensation554

Pulsed Laser Ablation555

Ion Sputtering557

Methods Using Liquid or Vapor Precursor557

Chemical Vapor Synthesis557

Laser Pyrolysis557

Synthesis of Nanopaicles by a Chemical Methods557

Nanoparticles：Biomedical Applications558

Tissue Engineering560

Manipulation of Cells and Biomolecules561

Protein Detection562

Cancer Therapy562

Semiconductor Nanowires563

General Synthetic Strategies563

Fabrication of Semiconductor Nanowires565

Fabrication of Metal Nanowires569

Electrochemical Fabrication of Metal Nanowires571

Negative Template Methods571

Anodic porous Alumina572

Fabrication of Metal Nanowires573

Positive Template Method575

Carbon Nanotube Template575

DNA Template575

Polymer Templates576

Applications of the Nanowires579

Magnetic Materials and Devices579

Optical Applications580

Biological Assays580

Chemical Sensors581

Carbon Nanotubes581

Structure of the Carbon Nanotube583

Synthesis of Carbon Nanotubes585

Growth Mechanisms of Carbon Nanotubes587

Carbon Nanotube Composite Materials588

Polymer NanoComposites590

Ceramic NanoComposites591

Ceramic Nanotube Composite Systems593

Ceramic-Coated MWNTs and SWNTs594

Conductive Ceramics595

Nanostructured Metals and Metal Composites595

Solid-State Powder-Based Processing596

Liquid-Phase Processing597

Surface，Interface，Nucleation and Reactivity599

Agglomeration，Dispersion and Sedimentation601

Properties602

Strength and Modulus602

Nanotribology603

Carbon Nanotubes：Biosensor Applications603

FET-Based Biosensors604

Aligned Nanoelectrode Array-Based Electronic Chips605

Index615