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电子组装技术专业英语PDF|Epub|txt|kindle电子书版本网盘下载

电子组装技术专业英语
  • 宋长发主编；文凤息，宋若翔副主编；罗源伟，李鹏，唐仪参编 著
  • 出版社： 北京：国防工业出版社
  • ISBN：9787118079524
  • 出版时间：2012
  • 标注页数：146页
  • 文件大小：29MB
  • 文件页数：154页
  • 主题词：电子元件－组装－英语－高等学校－教材

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图书目录

Unit One1

1.1 Printed circuit assembly3

1.2 Assembly techniques4

1.3 SMT design and assembly6

1.4 PCB assembly flows10

Unit Two SMC and SMD12

2.1 Surface mount device definitions12

2.2 Sizes of surface mount device12

2.3 SMD chip resistors13

2.4 SMD ceramic capacitors14

2.5 SMD Tantalum capacitors15

2.6 SMD MELF16

2.7 SMD transistors17

2.8 Mounting of Surface Mount component17

2.9 Component size comparison22

Unit Three Printed circuit boards26

3.1 The types of printed circuit board27

3.2 PCB design30

3.3 PCBs Raw Materials31

3.4 Drilling and plating the holes of printed circuit boards33

3.5 Creating the printed circuit pattern on the substrate34

3.6 Attaching the contact fingers35

Unit Four Adhesives39

Unit Five Types of solder paste fluxes47

5.1 Flux and its requirement48

5.2 Inorganic acid fluxes48

5.3 Organic acid fluxes49

5.4 Rosin50

5.5 No-clean fluxes51

Unit Six Solder alloys and applications54

6.1 Introduction54

6.2 Availability and type of solders55

Unit Seven Surface Mounted Technology68

7.1 Component Placement Machines68

7.2 Surface Mounted Technology71

7.3 Component pick-up head types75

Unit Eight Techniques of solder interconnection78

8.1 Soldering iron method78

8.2 Hot air reflow soldering method79

8.3 Laser reflow soldering method80

8.4 Pulse heating method80

8.5 IR method80

8.6 Vapor phase soldering(VPS)method82

8.7 Convection reflow method(air or N2 reflow)83

8.8 Combined convection IR method83

8.9 Flow/wave soldering method84

8.10 The temperature profile concept87

8.11 Pb-free soldering process92

Unit Nine Cleaning95

9.1 Water-soluble fluxes95

9.2 No-clean fluxes96

9.3 Pcb assembly cleaning96

9.4 Pcb cleaning test97

Unit Ten SMA inspection technique103

10.1 Vision system of component placement machines103

10.2 Inspection process107

10.3 Visual inspection equipment108

10.4 Visual inspection items109

Unit Eleven Handling and ESD control115

11.1 Electrostatic discharge115

11.2 ESD and EOS116

11.3 Requirements of static-free work station116

附录A CP-6系列富士贴片机操作简介121

A1.1 Machine components and operation panel121

A1.2 Starting and Stopping the Machine130

附录B 专业词汇142

References146

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